HELB Opens Undergraduate Loan Applications as Thousands of Continuing Students Race for KSh56.3 Billion Funding
Thousands of continuing university students across Kenya can now breathe a sigh of relief after the Higher Education Loans Board (HELB) officially opened applications for Undergraduate Subsequent Loans, paving the way for eligible learners to secure financial support for the 2026/2027 academic year.
The announcement, made on Tuesday, July 8, signals the beginning of another crucial funding cycle expected to benefit more than 400,000 continuing undergraduate students studying in both public and private universities.
In a statement, HELB urged eligible students to submit their applications promptly through its digital platforms.
“Ready to continue your educational journey? The Higher Education Loans Board (HELB) is pleased to announce that applications for the Undergraduate Subsequent Loan are now open,” the agency said.
The latest application window is specifically reserved for students seeking funding for their second, third or fourth loan application, depending on the duration of their academic programmes.
The development comes weeks after the government committed unprecedented funding towards higher education in the 2026/2027 National Budget, allocating a record KSh56.3 billion for university scholarships and student loans.
Out of the allocation, KSh30 billion has been earmarked specifically for university scholarships, with the remaining funds supporting loans administered through HELB as the government seeks to ease the financial burden facing thousands of students.
The investment reflects the state’s continued efforts to widen access to higher education at a time when rising tuition costs and the increasing number of university admissions have placed greater pressure on student financing.
Faster Digital Applications
Unlike previous years when students were required to complete lengthy manual processes, HELB has streamlined the application system through digital platforms.
Eligible students can now submit their subsequent loan applications using the official HELB Mobile App or by dialing the USSD code *642#, allowing applicants to complete the entire process without visiting HELB offices.
For the USSD option, applicants are required to dial *642# using their registered mobile phone, log in with their identification details, create a secure four-digit PIN, select the Subsequent Application option, choose the relevant loan category, accept the terms and conditions, and submit their application. Successful applicants receive a confirmation SMS containing a serial number.
Students opting for the HELB Mobile App must first download the application from the Google Play Store, register or sign in using their registered phone number, navigate to the “Loans” or “Subsequent Products” section, complete the required financial literacy questions, select a preferred payment method such as Mobile Money or Bank, and submit the application for processing.
The opening of the application portal is expected to trigger a surge in submissions as continuing students seek financial assistance before the commencement of the new academic cycle.
HELB has consistently encouraged students to apply early to avoid last-minute system congestion and ensure timely processing of their funding requests.
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